Mold-Tek Packaging Limited — Dividend/Bonus, 15-04-2026: Record Date

Mold-Tek Packaging has announced a board meeting on Monday, April 20, 2026, to consider declaring an interim dividend for FY2025-26. For investors to be eligible for this potential dividend payout, the company has fixed Friday, April 24, 2026, as the record date. Shareholders holding shares on this date will qualify for the interim dividend, if approved.